Key words: diamond materials, saw blade, industry patent, source: China superhard material network
Application No.: 201721828317.X
Inventor: Wang Jianguo
Abstract: The utility model discloses a diamond agglomerate flat grinding saw blade, which comprises a negative film and a buckle, an inner circular piece is fixed in a middle portion of the inner side of the inner film, and a knocking piece is arranged on both sides of the inner circular piece. A mounting ring is fixed to both inner ends of the wafer, and a sub-ring is connected to the inner side of the inner disc, and the buckle is mounted around the outer side of the inner disc, and the outer upper end of the negative film is embedded with a sub-piece, and the sub-piece is The outer top end is distributed with a wear-resistant block, the outer side of the inner piece is mounted with a main blade, and the right side of the main blade is connected with a sub-blade, and the outer bottom end of the negative piece is inlaid with a protective pad, and the outer side of the protective pad is fixed with a convex point. The diamond agglomerate flat grinding saw blade is provided with a secondary piece, and the secondary piece and the negative film are detachable devices, and when the wear block is seriously worn, the secondary piece can be taken out and replaced by rotating the negative piece without the entire flat grinding saw blade. Replacement, relatively reducing production costs.
Main claim:
A diamond agglomerate flat grinding saw blade comprising a backsheet (1) and a buckle (6), characterized in that: an inner disc (2) is fixed in a middle portion of the inner side of the backsheet (1), and an inner disc ( 2) on both sides of the knockout piece (3), the inner side of the inner piece (2) is fixed with a mounting ring (4), and the inner side of the inner piece (2) is connected with a secondary ring (5) The buckle (6) is mounted around the outer side of the inner wafer (2), the outer upper end of the negative film (1) is inlaid with a secondary piece (7), and the outer top end of the secondary piece (7) is distributed with wear resistance. a block (8), a main blade (9) is mounted around the outer side of the backsheet (1), and a sub-blade (10) is connected to the right side of the main blade (9), and the outer bottom end of the negative film (1) is inlaid There is a protective pad (11), and a bump (12) is fixed on the outer side of the protective pad (11), and a card slot (13) is disposed inside the bottom end of the sub-sheet (7), and the inner side of the negative film (1) A groove (14) is attached, and a cushion (15) is mounted on the inner side of the groove (14).
2. A diamond agglomerate flat grinding saw blade according to claim 1, wherein the area of the backsheet (1) coincides with the area of the secondary sheet (7), and the backsheet (1) and the secondary sheet (7) Between the detachable devices.
3 . The diamond agglomerate flat grinding saw blade according to claim 1 , wherein the mounting ring ( 4 ) is symmetrically distributed along a center line of the back sheet ( 1 ), and the mounting ring ( 4 ) is provided with 2 One.
The diamond agglomerate flat grinding saw blade according to claim 1, characterized in that the wear block (8) is evenly distributed at the upper end of the secondary piece (7), and the wear block (8) ) and the secondary piece (7) is welded.
The diamond agglomerate flat grinding saw blade according to claim 1, wherein the main blade (9) has an outwardly inclined structure, and the main blade (9) and the auxiliary blade (10) The space is a herringbone structure.
The diamond agglomerate flat grinding saw blade according to claim 1, wherein the distribution of the card slot (13) coincides with the distribution of the buckle (6), and the card slot (13), etc. The distance is evenly distributed inside the secondary piece (7).
-All diamond tools can be ordered and fabricated!
-Henry Wang | Quote Manager
-WhatsApp:+86-13459035657
-Email: ceo@zdiamondtools.com
-Web www.zdiamondtools.com
Company Profile
Certifications
Company Team
Exhibition
Logistics
FAQ