In the 1990’s, in order to solve the processing problem of large size silicon wafer, jigsaw machining technology are widely used to cut large size silicon wafer into blocks and pieces in the international marketing. Early jigsaw machining technology applied bare wire and free abrasive. In the process of machining, the free abrasive are added into wire and mechanical parts as the third party to cut. This technique is successfully used in processing of silicon and silicon carbide. In order to further shorten processing time, as well as on other hard material and ceramic, diamond abrasive will be fixed to a metal wire in a certain way, which compose a fixed diamond wires saw.

As shown in figure, cutting lines with high-speed reciprocating motion drive the slurry to the cutting area, which makes the abrasive particles (SiC particles) in the mortar and the surface of silicon rod make high speed grinding. Because the abrasive particles have very sharp edges and its hardness is greater than the hardness of silicon rods, the contact area of silicon rod and diamond wires saw are grinded out gradually by mortar. Thus the effect of cutting will be achieved, and meanwhile the mortar also can take away a lot of hot produced in the grinding.

In the process of cognition of diamond wire saw cutting mechanism, many researchers believe that the micro cutting movement of diamond grits is a scroll and embedded process. They put forward the "scroll - embedded" model. Z-LION reachers put forward diamond wire sawing force drives on the abrasive grits rolling along the cutting surface, squeezing and embedded abrasive cutting surface at the same time. Consequently there is a flake piece of chip and surface crack, forming the big cutting function. Z-LION researchers pointed out that in "scroll - embedded" model, the particle movement also includes scratches, in addition to the rolling and embedded. All three work together for cutting. Bhagavat and some researchers considered the effect of pulping in this model and believe that the diamond saw wire leads free abrasive cutting silicon ingot of small area, and the movement of diamond wires saw and grinding pulping form a elastic fluid dynamic environment. They can use the finite element method (fem) to analysis the elastic fluid dynamics model of diamond wires saw and silicon ingot to get the function of diamond wire walking speed, viscosity of grinder and cutting conditions. Then they draw the conclusion: pulping film thickness is greater than the average particle size, is the flow of the abrasive cutting.

Diamond Multi-wire Saw for Slab Cutting

It is widely used in multi-wire saw machine to cut different kinds of granite slabs.

Z-LION (short for Xiamen ZL Diamond Technology Co., Ltd.) is a professional manufacturer of diamond tools in Xiamen, China. Established in 2002 and listed in New Third Board as a public company (stock code: 831862) in 2015. Quality, Efficiency, Innovation and Integrity is our aim and also our culture.

Z-LION have been engaged in developing and manufacturing diamond tools for concrete floor polishing since its establishment. Products include metal bond grinding pads for all kinds of floor grinders, resin bond polishing pads for wet and dry polishing, transitional polishing pads, PCDs, bush hammers, cup wheels, edge and corner polishing pads, sponge polishing pads, quick change adapters etc.

Z-LION attach much importance to innovation. We are honored as” National Intellectual Property Advantage Enterprise”, “Fujian Innovative Enterprises”. We own 63 of domestic and international patents. We are setter of “Diamond Flexible Polishing Pads Industrial Standard”.

Z-LION always do our best to keep close to customers. We have attended more than 100 exhibitions all over the world. Face to face meeting with customers in the exhibitions helped us to find out which kind of diamond tools will make polishing more efficient, so that we can keep updating our existing products and developing new products. Our products are loved by our customers especially in Europe, North and South American, Australia and Middle East.

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